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by EE Times On Air
EE Times Current provides a deep dive into the most compelling stories in the electronics industry. Tune in to keep yourself current on what matters to design engineers and other tech industry professionals
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The most recent episodes — sign up to get AI-powered summaries of each one.
- 2 days ago57 min
Why Computing With Time Gives Neuromorphic AI an Edge
In this month's Brains and Machines, Dr. Ryad Benosman discusses event-based vision, retinal prosthetics, and neuromorphic startups with Dr. Sunny Bains of University College London. A co-founder of Prophesee, he explains why he believes AI's future must come from neuromorphic engineering. Discussion follows with Dr. Giulia D’Angelo from the Czech Technical University in Prague and Professor Ralph Etienne-Cummings of Johns Hopkins University.
- 2 weeks ago23 min
Where Software Meets Silicon: A Digital Twin Playbook
As systems become more software-defined, the traditional development model of waiting for hardware before serious software validation begins is no longer sustainable. Software teams need platforms earlier. Hardware teams need realistic workloads sooner. Verification teams need better ways to expose system-level issues before tapeout. We will look at how digital twins are becoming the shared foundation for this new HW/SW co-development model. Using virtual platforms, hardware emulation, and FPGA prototyping, teams can start earlier, collaborate more closely, and design/optimize/validate with greater confidence. We will also discuss new system-level verification challenges in power, performance, and DFT, showing how pre-silicon Hardware platforms can help teams find critical issues earlier and deliver more robust software-defined systems.
- 3 weeks ago24 min
Trust at Scale: The Next Challenge for AI-Driven Semiconductor Development
Artificial intelligence is accelerating semiconductor development, but more compute, more automation, and more engineering data do not automatically create better decisions. As design and manufacturing workflows become increasingly AI-enabled, a new constraint is emerging: trust. In this episode, Dr. Jim Shiely builds on themes from his Patterning the Singularity leadership work to explore the semiconductor industry’s “trust bottleneck” and why trustworthy engineering intelligence is becoming essential to future innovation.
- 3 weeks ago1h 0m
Do Spikes Need Common Language for Sensing and Learning?
On this month's episode of Brains and Machines, five engineers debate neuromorphic sensing and learning. Recorded at the Neuromorphic Hardware and Algorithms conference at the University of Sussex, the panel explores whether events and spikes are the right framework for integrating sensor modalities, motor control, and learning across systems. They also examine commercial directions and revisit the perennial question: what is neuromorphic engineering?The panelists are:Dr. Chiara Bartolozzi (Italian Institute of Technology) Dr. Federico Corradi (Eindhoven University of Technology) Dr. James Knight (University of Sussex) Dr. Laura Kriener (Institute of Neuroinformatics, Zurich) Dr. Sebastian Siegel (Peter Grünberg Institute, Jülich)The session is chaired by Dr. Sunny Bains (University College London), followed by a discussion with Dr. Giulia D’Angelo (Czech Technical University in Prague) and Professor Ralph Etienne-Cummings (Johns Hopkins University).
- Aug 21, 202618 min
Designing the AI Factory from the Rack Up
For years, AI infrastructure was measured at the scale of the data center. That's changed. In this episode, Neeraj Paliwal explains why the rack has become the indivisible unit of a modern AI system — designed as one system rather than a collection of servers — and why performance is no longer defined by the compute in any single box, but by how efficiently data moves, is stored, and is secured across the entire rack. And getting there depends on co-designing the silicon, memory, interconnect, and packaging together, with the IP foundation turning concentrated power into usable compute.
- Aug 7, 202623 min
Beyond Automation: Self-Verifying AI Agents for Semiconductor and PCB Design
As AI agents grow more capable, the question of trust becomes increasingly critical, especially in complex engineering environments like semiconductor and PCB design. Siemens EDA and NVIDIA are tackling that challenge head-on, combining deep EDA domain expertise with cutting-edge AI infrastructure to deliver a new generation of agentic AI capabilities for engineering teams. In this episode, we sit down with Amit Gupta, Chief AI Strategy Officer at Siemens EDA, and Tim Costa, VP and GM of Industrial and Computational Engineering at NVIDIA, to explore how their collaboration is shaping the future of EDA workflows. Together, they discuss domain-scoped AI agents that don't just execute tasks but verify their own outputs using physics-based EDA software validation, purpose-built to support the demands of long-running engineering workflows. We dig into what self-verifying agentic AI actually means in practice, what the Siemens and NVIDIA collaboration looks like under the hood, and what it delivers in terms of tool-calling reliability, token efficiency, result quality, and time-to-results for engineering teams working across the full EDA lifecycle.
- Jul 22, 202658 min
Can Great Sky’s Light-Connected AI Enable Bigger Brains?
In this month’s Brains and Machines podcast, Dr. Jeff Shainline talks about superconducting neural hardware with Dr. Sunny Bains of University College London. Currently in development at Great Sky in Boulder, Colorado, the new systems will incorporate photonic interconnects and a neuromorphic approach to intelligence. Discussion follows with Dr. Giulia D’Angelo from the Czech Technical University in Prague and Professor Ralph Etienne-Cummings of Johns Hopkins University.
- Jun 27, 202632 min
Under the Hood of Intelligent Systems
Some of the most critical semiconductor innovation today sits beneath intelligent systems, where data moves, connects, and scales. As architectures become more distributed, sensor-rich, and AI-driven, challenges in bandwidth, latency, power, and interoperability intensify. In this episode, we unpack the interface technologies driving this evolution: from automotive SerDes to advanced imaging and next-gen connectivity.
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About EE Times Current
EE Times Current provides a deep dive into the most compelling stories in the electronics industry. Tune in to keep yourself current on what matters to design engineers and other tech industry professionals
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